Top part of the model, isolated
The large gray box on the top left is a portion of the integrated
circuit die, connected to the package with C4 balls
in "flip-chip" fashion.
The smaller gray box on the right is the capacitor.
The green cross-hatch is the meshed package ground plane.
A similar layer for the power plane is not shown.
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Package layer 3, isolated
The blue traces shown here are in package layer 3.
The interconnects highlighted in white form a differential signal pair
that are routed up from the PCB, through this layer, and into the IC.
The rose and lime vertical interconnects are power and ground vias.
The signal vias are shown in yellow.
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BSM layer, isolated
This is the bottom surface metal pad layer of the circuit board.
The large rings are the pads, placed with a 50-mil pitch.
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Complete model
On top are the die and capacitor, mounted on the four-layer
package interconnect, all within the CBGA.
The CBGA itself is mounted on the printed circuit board,
which is shown at the bottom.
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